Design of enclosures for electronic devices (ECU, evaluation equipment, etc.) / CAE analysis
Achieves miniaturization and ease of use through integrated hardware/case design. Design considerations will be conducted using analyses such as CAE.
We undertake detailed design of enclosures. We can handle enclosure design using 3D-CAD and thermal/stress analysis and countermeasures using CAE. Please feel free to contact us if you have any requests. 【Examples】 ■ Development of HV-ECU for racing cars (2013) <On-site at client, contracted> - Conducted enclosure design that balances product durability and heat dissipation with compactness and high performance using CAE in the harsh environment of racing. - Provided feedback and proposals for circuit design by collaborating with hardware design. ■ Enclosure design (2014) <Contracted by Nox Electronics> - Conducted enclosure design and aesthetic considerations focused on assembly and usability. - Achieved miniaturization thanks to close collaboration with the hardware design of the contents. *For more details, please download the PDF or feel free to contact us.
- Company：ノックス電子
- Price：Other
![[Example] Contracted Level 1 Analysis Only](https://image.www.ipros.com/public/product/image/fe0/2000904155/IPROS66638168760392453177.png?w=280&h=280)
